Fixya360 - Fixya360 - Fixya360, Fix Ya 360, Fixya 360
Description: The motherboard has hit temperatures so high that it has caused it to warp, breaking and cracking solder joints(leaving chips not 100% connected to the board). Now it is not only overheating that causes the warp. The way Microsoft has the motherboard mounted inside the case sets it up for failure right out of the gate, its just a matter of time. The FixYa360 method will deal with this very important issue from the core and change how the motherboard is mounted inside the case, and that's not all. What good is remounting the motherboard if its already warped with cracked solder joints? Well the FixYa360 method also reveals a very unique and effective way of un warping the board and reconnecting the solder joints WITHOUT SOLDERING ANYTHING. ...More Info Similar eBooks & Software Sites : Relevant Categories : |
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